Diamond Grinding Wheel Fitting

• Material: Diamond
• Abrasive: Superabrasive
• Shapes: Section Shape
• Types: Surface Grinding Wheel
• Grain Size: 240#
• Cylindricity: <0.05
• Circular Degree: <0.05
• Technics: Diamond
• Working Style: Surface Grinding
• Diameter: 300mm
• Thickness: 50
• Hole Diameter: 48
• Diamond Grit: 200#
• Type of Technical: Hot Press
• Transport Package: Carton
• Specification: SGS
• Trademark: RECO
• Origin: China
• HS Code: 8207201000
• Production Capacity: 50000PCS/Year

Product Description

 

Diameter(mm)	Hole(mm)	Thickness(mm)	Diamond grit	Work part(mm)	Kind of grinding
300	48	50	200	10x3.3	Rough grinding

  Diamond grinding wheels for the surface of silicon ingot grinding before cutting waffer.
  The surface of silicon ingot will be better after grinding. 
  Try it,and you will love it!
  Customized size available on request.